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| AGC Transimpedance Amplifier SONET OC-3 PRELIMINARY DATA SHEET-Rev 2 FEATURES * * * * * Single +5 Volt Supply Automatic Gain Control -41 dBm Sensitivity 0 dBm Optical Overload 120 MHz Bandwidth 925 m IIN GND VDD1 GND GND ATA01502 100 m VDD2 APPLICATIONS * * * SONET OC-3/SDH STM-1 (155 Mb/s) Receiver FDDI, Ethernet Fiber LAN Low Noise RF Amplifier VOUT GND GND GND CBY CBY GND CAGC GND 1250 m D1 PRODUCT DESCRIPTION The ANADIGICS ATA01502 is a 5V low noise transimpedance amplifier with AGC designed to be used in OC-3/STM-1 fiber optic links. The device is used in conjunction with a photodetector (PIN diode or avalanche photodiode) to convert an optical signal into an output voltage. The ATA01502 offers a bandwidth of 120MHz and a dynamic range of 42dB. It is manufactured in a GaAs MESFET process and is available in bare die form. VDD1 VDD2 AGC 40K 70K + IIN GND or neg.supply CAGC 4.5pF VOUT - 45 VGA + 0.8 US PATENT GND CBY Photodector cathode must be connected to IIN for proper AGC Operation Figure 1: Equivalent Circuit 08/2001 ATA01502 100 m V DD2 V DD1 GND GND 925 m I IN GND V OUT GND GND GND CBY CBY GND C AGC GND 1250 m Figure 2: Bonding Pad Layout Table 1: Pad Description PAD V DD1 V DD2 IIN VOUT C AGC C BY D escription V DD1 V DD2 TIA Input C urrent TIA Output Voltage External AGC C apaci tor Input Gai n Stage Bypass C apaci tor C omment Posi ti ve supply for i nput gai n stage Posi ti ve supply for second gai n stage C onnect detector cathode for proper operati on Requi res external D C block 70K* (4.5p + C AGC ) = AGC Ti me C onstant >56 pF ELECTRICAL CHARACTERISTICS Table 2: Absolute Maximum Ratings V DD1 V DD2 IIN TA TS 7.0 V 7.0 V 5 mA Operati ng Temp. - 40 C to 125 C Storage Temp. - 65 C to 150 C Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. 2 PRELIMINARY DATA SHEET - Rev 2 08/2001 ATA01502 Table 3: Electrical Specifications (1) (TA = 25C, VDD =+5.0V + 10%, CDIODE + CSTRAY = 0.5 pF, Det. cathode to IIN) PAR AMETER Transresi stance (RL= ,IDC<500nA) Transresi stance (RL=50 W) Bandwi dth -3dB Input Resi stance (2) Output Resi stance Supply C urrent Input Offset Voltage Output Offset Voltage AGC Threshold (IIN) Opti cal Overload (4) (5) (3) (1) MIN 20 9.5 110 30 1.0 TYP 30 13 120 1000 50 30 1.4 1.4 15 MAX 10 U N IT KW KW MHz W 60 45 W mA Volts Volts mA dB m nA 0 1 12 16 1 -41 Input Noi se C urrent Offset Voltage D ri ft AGC Ti me C onstant (6) Opti cal Sensi ti vi ty (7) Operati ng Voltage Range Operati ng Temperature Range Thermal Resi stance + 4.5 - 40 m se c mV/ C dB m + 6.0 85 Volts C C /W + 5.0 20 Notes: 1. f = 50MHz 2. Measured with Iin below AGC Threshold. During AGC, input impedance will drecrease proportionally to Iin. 3. Defined as the Iin where Transresistance has decreased by 50%. 4. See note on Indirect Measurement of Optical Overload. 5. See note on Measurement of Input Referred Noise Current. 6. CAGC = 220 pF 7. Parameter is guaranteed (not tested) by design and characterization data @155 Mb/s, assuming dectector responsivity of 0.95. PRELIMINARY DATA SHEET - Rev 2 08/2001 3 ATA01502 APPLICATION INFORMATION V DD 56pF 56pF V DD2 V DD1 G ND GN D PIN I IN G ND GN D G ND G ND CBY CBY GND C AGC V OUT G ND OUT 56pF 56pF Figure 3: ATA 01502D1C Typical Bonding Diagram Bandwidth (MHz) Power Supplies and General Layout Considerations The ATA01502D1C may be operated from a positive supply as low as + 4.5 V and as high as + 6.0 V. Below + 4.5 V, bandwidth, overload and sensitivity will degrade, while at + 6.0 V, bandwidth, overload and sensitivity improve (see Bandwidth vs. Temperature curves). Use of surface mount (preferably MIM type capacitors), low inductance power supply bypass capacitors (>=56pF) are essential for good high frequency and low noise performance. The power supply bypass capacitors should be mounted on or connected to a good low inductance ground plane. General Layout Considerations Since the gain stages of the transimpedance amplifier have an open loop bandwidth in excess of 1.0 GHz, it is essential to maintain good high frequency layout practices. To prevent oscillations, a low inductance RF ground plane should be made available for power supply bypassing. Traces that can be made short should be made short. The utmost care should be taken to maintain very low capacitance at the photodiode TIA interface (I IN), as excess capacitance at this node will cause a degradation in 4 bandwidth and sensitivity (see Bandwidth vs. CT curves). C T = 0.5 pF 140 130 120 110 100 90 -40 10 60 85 Temperature ( OC) VDD = 4.5 V VDD = 5.0 V VDD = 5.5 V Figure 4: Bandwidth vs. Temperature PRELIMINARY DATA SHEET - Rev 2 08/2001 ATA01502 150 Bandwith (MHz) 140 130 120 110 100 90 0 2500 VDD = 5.5 V VDD = 5.5 V VDD = 5.0 V VDD =4.5 V RF 900 VDD = 4.5 V 0 .2 0 .4 0 .6 0 .8 1 .0 1 .2 1 .4 1 .6 IIN 1502 50 120 - 2.2 - 1.7 - 1.2 - 0.7 - 0.2 CT (pF) Figure 5: Bandwidth vs. CT Note: All performance curves are typical @ TA =25 C unless otherwise noted. IIN (mA DC) Figure 7: Bandwidth vs. IIN IIN Connection (Refer to the equivalent circuit diagram) Bonding the detector cathode to IIN (and thus drawing current from the ATA01502D1C) improves the dynamic range. The detector may be used in the reverse direction for input currents not exceeding 13 mA, however the specifications for optical overload will not be met. 13.0 RF 11.0 9.0 50 Transimpedance (K Ohm) 15.0 VOUT Connection The output pad should be connected via a coupling capacitor to the next stage of the receiver channel (filter or decision circuits), as the output buffers are not designed to drive a DC coupled 50 ohm load (this would require an output bias current of approximately 36 mA to maintain a quiescent 1.8 Volts across the output load). If VOUT is connected to a high input impedance decision circuit (>500 ohms), then a coupling capacitor may not be required, although caution should be exercised since DC offsets of the photo detector/TIA combination may cause clipping of subsequent gain or decision circuits. 3.4 3.2 3.0 2.9 2.7 2.5 2.4 2.2 2.0 1.9 1.7 1.5 1.4 1.2 1.0 0.8 0.7 0.5 0.3 0.2 0.0 heavy AGC Output Collapse VDD =5.5 V Linear Region RF I 5.0 VDD = 5.5 V VDD = 4.5 V -2.2 - 1.7 -1.2 - 0.7 IIN (mA DC) - 0.2 3.0 1.0 0.0 IIN VDD =4.5 V -5 -4 -3 1502 VOUT Figure 6: Transimpedance vs. IIN -2 IIN (mA DC) Figure 8: VOUT vs. IIN VOUT (Volts) IIN 7.0 PRELIMINARY DATA SHEET - Rev 2 08/2001 Bandwidth (MHz) 5 B(3dB)~ A / 2 RF(CIN +CT) ATA01502 1.55 1.50 Input Offset Voltage 1.45 1.40 1.35 1.30 1.25 1.20 1.15 - 40 VDD = 4.5V 10 60 Temperature (OC) VDD = 5.5 V VDD = 5.0V Figure 9: Input Offset Voltage vs. Temperature Indirect Measurement of Optical Overload Optical overload can be defined as the maximum optical power above, which the BER (bit error rate) increases beyond 1 error in 10 10 bits. The ATA01502D1C is 100% tested at die sort by a DC measurement, which has excellent correlation with a PRBS optical overload measurement. The measurement consists of sinking a negative current (see VOUT Vs IIN figure) from the TIA and determining the point of output voltage collapse. In addition, the input node virtual ground during heavy AGC is checked to verify that the linearity (i.e. pulse width distortion) of the amplifier has not been compromised. As a final test, a DC transfer curve is performed on every die at the wafer level to ensure excellent overload performance. Measurement of Input Referred Noise Current The Input Noise Current is directly related to sensitivity. It can be defined as the output noise voltage (VOUT), with no input signal, (including a 100 MHz lowpass filter at the output of the TIA) divided by the AC transresistance. pA/ CBY Connection The CBY pad must be connected via a low inductance path to a surface mount capacitor of at least 56pF (additional capacitance can be added in parallel with the 56 pF or 220 pF capacitors to improve low frequency response and noise performance). Referring to the equivalent circuit diagram and the typical bonding diagram, it is critical that the connection from CBY to the bypass capacitor use two bond wires for low inductance, since any high frequency impedance at this node will be fed back to the open loop amplifier with a resulting loss of transimpedance bandwidth. Two pads are provided for this purpose. Sensitivity and Bandwidth In order to guarantee sensitivity and bandwidth performance, the TIA is subjected to a comprehensive series of tests at the die sort level (100% testing at 25 oC) to verify the DC parametric performance and the high frequency performance (i.e. adequate |S21|) of the amplifier. Acceptably high |S21| of the internal gain stages will ensure low amplifier input capacitance and hence low input referred noise current. Transimpedance sensitivity and bandwidth are then guaranteed by design and correlation with RF and DC die sort test results. In applications that require - 41 dBm sensitivity, a low capacitance (< 0.5pF) and high responsitivity (> 0.95) photodiode must be used. 8 7 6 RF CT 1502 50 Hz 5 4 3 2 1 1 CT = 1.0pF CT =0.5pF 10 100 1000 Frequency (MHz) Figure 10: Input Referred Noise Spectral Density 6 PRELIMINARY DATA SHEET - Rev 2 08/2001 ATA01502 Input Referenced Noise Test Circuit Input Referred Noise in (nA RMS) 14 13 12 11 10 09 - 40 0 0.5pF TIA 25 dB 100 MHz LPF VDD = 4.5 V 180 Degrees 200 220 240 RF IIN 0.5pF VDD = 5.5V (dBm) = 10 LOG VOUT 1502 6500i n R 80 40 Temperature (OC) 50 100 Frequency (MHz) Figure 12: Phase (IIN to VOUT) 150 FIgure 11: Input Referred Noise vs Temperature AGC Capacitor It is important to select an external AGC capacitor of high quality and appropriate size. The ATA01502D1C has an on-chip 70 K W resistor with a shunt 4.5-pF capacitor to ground. Without external capacitance, the chip will provide an AGC time constant of 315 nS. For the best performance in a typical 155 MB/s SONET receiver, a minimum AGC capacitor of 56pF is recommended. This will provide the minimum amount of protection against pattern sensitivity and pulse width distortion on repetitive data sequences during high average optical power conditions. Conservative design practices should be followed when selecting an AGC capacitor, since unit to unit variability of the internal time constant and various data conditions can lead to data errors if the chosen value is too small. Phase Response At frequencies below the 3dB bandwidth of the device, the transimpedance phase response is characteristic of a single pole transfer function (as shown in the Phase Vs Frequency curve). The output impedance is essentially resistive up to 1000 MHz. PRELIMINARY DATA SHEET - Rev 2 08/2001 7 ATA01502 ORDERING INFORMATION PAR T N U MB ER ATA01501D 1C PAC K AGE OPTION D 1C PAC K AGE D ESC R IPTION Die ANADIGICS, Inc. 141 Mount Bethel Road Warren, New Jersey 07059, U.S.A Tel: +1 (908) 668-5000 Fax: +1 (908) 668-5132 http://www.anadigics.com Mktg@anadigics.com IMPORTANT NOTICE ANADIGICS, Inc. reserves the right to make changes to its products or to discontinue any product at any time without notice. The product specifications contained in Advanced Product Information sheets and Preliminary Data Sheets are subject to change prior to a products formal introduction. Information in Data Sheets have been carefully checked and are assumed to be reliable; however, ANADIGICS assumes no responsibilities for inaccuracies. ANADIGICS strongly urges customers to verify that the information they are using is current before placing orders. WARNING ANADIGICS products are not intended for use in life support appliances, devices, or systems. Use of an ANADIGICS product in any such application without written consent is prohibited. PRELIMINARY DATA SHEET - Rev 2 08/2001 8 |
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